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The AMB-technology (Active Metal Brazing)

  • 23,363,950 $

Investment project for the manufacturing of components for power electronics. Pilot samples were obtained. 

Readiness Level - TRL-6.
They plan to start production in one of the technology parks in Taiwan or Malaysia.

Advantages of the proposed technology for the production of AMB-substrates

  • High performance thermal conductivity
  • High strength indicators

  • High performance heat resistance

  • Technology does not have world analogues

  • Technology is not being used silver that allows to reduce the cost

  • Popular product

  • Fire and explosion safety

  • Environmentally friendly production

 

Product: 

Temperature cycling
AMB AlN> 100 cycles
AMB Si3N4> 1000 cycles
(Test conditions -55 ° C to 150 ° C, holding for 30 minutes)

Tensile strength at break (speed 50 mm / min):

- AMB AlN ≥ 4 N / mm

- AMB Si3N4 ≥10 N / mm

 

Products based on Si3N4 provide higher performance due to the physical properties of the material.

 

Cost price of production

140 * 190 mm, a capacity of at least 30 000 pieces per month.
For example:

Cu 0,5 мм +Si3N40,32 мм +Cu 0,5 мм :

  1. Substrate-11Euro.
  2. Copper 0.5 мм – 4 Euro.
  3. Solder - 2 Euro.
  4. Consumables - 5 Euro.
  5. Production cost – 4 Euro.

Total - 26 Euro.

 

Cost price of production

140 * 190 mm, a capacity of at least 30 000 pieces per month.
For example:

Cu 0,8 мм+Si3N40,32 мм+Cu 0,8 мм :

  1. Substrate - 11 Euro.
  2. Copper 0.8 мм – 7 Euro.
  3. Solder - 2 Euro.
  4. Consumables - 5 Euro.
  5. Production cost – 4 Euro.

Total - 29 Euro.

AMB substrates market is growing steadily every year.

Application area:
• Thermoelectric modules, Peltier elements;
• Power electronics (IGBT modules, telecommunications, in cooling systems and in High-power LEDs);
• High-power semiconductor devices and their array packages;
• Auto Electronics;
  and other.

AMB-technology is an extension DBC-technology and is designed to solve the problem of the mismatch coefficient of linear expansion of ceramics and copper by means of intermediate layers that absorb stresses arising in connection with the temperature variations, which improves the adhesion resistance. This technology involves the formation on the surface of the ceramic thin sublayer of the active metals or mixtures thereof, and the further formation of the thick copper layer is formed by soldering the copper foil (the last pre-cleaning). Main consumers: Infineon Technologies, Toshiba, Siemens AG, ABB, Fuji Electric ...

With this technology it is possible to obtain a ceramic substrate with copper metallization improved adhesion and resistance to thermal cycling.

1) Preparing the ceramic substrate and copper sheets

2) Preparation and assembly of sandwich solder (copper-ceramic-copper)

3) Brazing furnace

4) Laser processing of edges

 

Total net profit for 5 years -  146.804 ml EUR

Investments - 15, 13 ml EUR

Learn more

Tags: The AMB-technology (Active Metal Brazing), Russia, Investments

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